Miscellaneous
Process | Description |
---|---|
Step Height thickness measurement | Step heights from 50A to 400um can be made using a computer controlled stylus profilometer. The stylus force can be adjusted so polymers samples such as photoresist can be measured. |
Spin Dryer Operation |
SEMITOOL SPD015
|
Wafer grip removal |
To release wafers bonded using Dyantex wafergrip a specialized solvent called Stripaid
is used. An attached PDF provides process detail for the use of this solvent. Be aware
that the order of steps is very important, acetone evaporates quickly so a fast transfer
into 2-proponal (isoproponal) is crucial, else residue may dry on the substrate that
will prove difficult to remove. |
Shield Change for Amod Evaporator |
|