To release wafers bonded using Dyantex wafergrip a specialized solvent called Stripaid is used. An attached PDF provides process detail for the use of this solvent. Be aware that the order of steps is very important, acetone evaporates quickly so a fast transfer into 2-proponal (isoproponal) is crucial, else residue may dry on the substrate that will prove difficult to remove.

Remember to have the following bath ready before removing wafers from solution for all the steps.

Attached Documents

  • application/pdf iconStripAid_Tech_Data_Sheet.pdf