Photo of PVA Tepla Ion 10

Description

The PVA Tepla IoN Wave 10 is a batch-mode plasms system primarily used for stripping resist, cleaning, and surface pretreatment.

 

Processes

O2 Descum

  • Microwave plasma O2+Ar slow ashing process used to remove residual photoresist.

R1 S1813 on Si ashing

  • No faraday cage; wafer in vertical position, centered in chamber

1.3um S1813 on 100mm Silicon wafer

Ash time 4 min

R2 S1813 on Al Ashing

  • With faraday cage; wafer in vertical position, centered in chamber

1.3 uM S1813 on 100 mm Aluminum coated Silicon wafer
36 minute ash

R3 S1813 on Si Descum

  • With faraday cage, wafer in vertical position, centered in chamber.

1.3 uM S1813 on 100 mm Silicon wafer.

2 min descum removes 45 +/- 6 nm

R4 S1813 on Al Descum

  • With faraday cage; wafer in vertical position, centered in chamber.

1.3 uM S1813 on Al coated Si water

4 min descum removes 21 +/- 15 nm

 

Operating Manual

*Note that the instructions below may not contain the most recent updates. Please refer to the manuals printed and posted at the equipment.

 

  • To avoid electrical shocks, do not use the system if it is missing panels or electrical equipment is exposed.
  • The samples and trays may be very hot after long runs. Use caution.
  • In case of immediate electrical, chemical, or physical danger, utilize the red EMO button situated on the front of the equipment.

The etch rate in this tool is very non-linear because there is no substrate temperature control. For example, the average removal rate over a one minute etch will be significantly less than over a five minute etch.

Substrates must be clean and dry.

Do not place wet/dirty substrates in the PVA TePla.

Do not edit any MMF recipes without prior approval.

  1. Turn on the computer screen by clicking on the left mouse button to wake up the screen.
  2. If system is not logged in, login to the system using “Admin” for the username and “Admin001” for the password.
  3. You should be on the main operating screen. If not, click the “Operation” button on the lower left side of the screen. Then make the “System” tab is selected on the top of the screen.
  4. In the “Operation” box in the upper right-hand corner of the screen, “Idle Vac” should be selected. To vent the chamber to open the door, press the “Vent” option, then “Run”. The tool should vent in 30 s to 1 minute.
  5. Open the door. Load your samples into a quartz wafer holder and place it inside the tool. The quartz wafer holders are located on top of the tool. You may use the Faraday cage in the tool but remove it after use. Wipe the sealing surfaces, then close the chamber door.
  6. Click the “Load Recipe” button on the lower right-hand side of the screen. A new window will pop up with all the saved recipes in our database. Select the recipe you want to use and then press the “Open” button on the bottom right corner of the screen. If the recipe loaded properly, the name should appear in the recipe section in the Location/Name box on the bottom of the screen.
  7. In the “Operation” box, select “Recipe”, then press the “Run” button. A window will pop up asking for Lot/Batch ID, enter whatever you would like, then press “OK”. You will hear the vacuum make a loud noise and the clock starts on the left-hand side of the screen. Each step of the process will be displayed. Monitor the process.
  8. When the process is finished, the “Final Result” box will say “Passed” with a green background and all steps will be complete.
  9. Remove the quartz tray with samples from the tool. The samples and tray might be hot. Use caution.
  10. When you are done, close the chamber door, select “Idle Vac” in the “Operation” box, and press “Run”. You should hear the tool pump down.
  • Main chamber will not vent.
    • Contact MMF Staff
  • Error message pops up: "LTD too low for Plasma On!!"
    • Acknowledge the error message. After acknowledging, another window should pop up asking if you want to purge. Click “No”. Try to run your recipe again. It should run successfully, but if it does not, contact MMF Staff.