Single-Layer Process Setup

  1. Click on the“Edit” tab of the menu selection and then click “Process.” The Process Edit dialog box will show the setup of the last process run.
  2. Click the “New” button in the dialog box. Add a name for the new process and click “Enter” to save the new name.
  3. Click the “Layer” tab to assure the layer parameters are displayed.
  4. Click the “Initial Rate” setting. This is the deposition speed and is measured in A/s. The “Final Thickness” can be adjusted to a thickness measured in kA. Note: 1kA=100nm
  5. If you want to adjust the deposition rate during a layer process, edit the Rate Ramp. Click “Rate Ramps” tab and then click “Insert Ramp” (inserts a new rate ramp). Adjust the “Start Thickness” (the thickness that triggers a timed ramp to a new rate), “Ramp Time” (the time to ramp to the new rate {measured in seconds}) and “New Rate” (the new deposition rate setpoint for the selected layer). Note: The start thickness should be greater for each subsequent ramp and less than the final layer thickness, otherwise the rate ramp is skipped.
  6. Next, edit the Pre/Post Conditioning using the Condition Tab. This tab will precondition the source material. Ramp 1 will set the power level that is desired at the end of the ramp phase in % of full scale. Ramp time sets the time to ramp with a linear rate from the initial power to the Ramp power. Soak time sets the time the output remains at the ramp power level. Ramp 2 has the same function as Ramp 1. Typically, Ramp 2 power is set near the power level required to match the initial deposition rate. The Feed phase begins immediately after deposition is complete. It holds output power at the level and time required to wire feed new material. The Idle phase follows the Feed phase. Idle phase ramps the material to a state that is ready for deposition, typically the same as Ramp 2 power.
  7. Select the Deposition Tab. This tab contains the P, I, and D term as well as the Shutter Delay. The P-Term sets the gain of the control loop. High gains yield more responsive (but sometimes unstable) loops. A value of 50 is a good starting point. The I-term controls the time constant of the loop response. A small I term (.5-1 second) will smooth the response of most loops. The D-term causes the loop to respond quickly to changes. Use 0 or a very small value to avoid oscillations. Shutter Delay, when enabled, requires the system to reach the programmed control accuracy and maintain it for 5 seconds before deposition begins. If the programmed accuracy isn’t reached, the process will stop.
  8. Select the Source/Sensor Tab. This tab contains the Material, Output, Source Index, Max Power, and Slew Rate features. The Material option selects the deposition material. The Output assigns the selected material to one of the source control outputs. When an output is selected, the Sensor Tooling panel changes to show only the sensors that are assigned to that output in the Edit, System dialog. The Source Index assigns each film to a specific pocket. The Max Power is the maximum output power allowed for the selected output, it controls the maximum % of full scale power that can be used by a given film. The Slew Rate sets the maximum power change allowed on an output per second.
  9. Click “Close Form” to save the single-layer process. If you are asked to “Do you want to change..” answer Yes to make the new process the current process.