The Oxford Plasmalab ICP 100 uses CHF3, oxygen and argon to etch lithium niobate.
The etch rate seems to vary significantly but was measured at about 20 nm/min.
As etch time increases the etch seems to slow as a passivation layer is formed on
the lithium niobate sample.
Attached Documents
Lithium Niobate Etch Recipe.pdf
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