The Oxford Plasmalab ICP 100 uses a gas chemistry of chlorine for the initial aluminum
oxide breakthrough and then HBr gas to etch the Al.
The etch rate has be measure at about 1075 nm/min for a thick film of Al with a thickness
of 2.7um.
This gas chemistry will etch Si so silicon dioxide is needed to stop the etching beneath
the Al.
Attached Documents
Aluminum HBr Etch Recipe.pdf
Montana Microfabrication Facility (RRID:SCR_026333) Cobleigh and Barnard Hall Montana State University P.O. Box 173400 Bozeman, MT 59717
Facility Manager: Dr. Andrew Lingley Montana State University 518 Cobleigh Hall Bozeman, MT 59717 Phone: (406) 994-2518 Email: andrew.lingley@montana.edu
Facility Director: Dr. David Dickensheets Montana State University 530 Cobleigh Hall Bozeman, MT 59717 Phone: (406) 994-7874 Email: davidd@montana.edu
Student Offices: 540 Cobleigh Hall Phone: (406) 994-3112
Aluminum HBr Etch Recipe.pdf