• The Oxford Plasmalab ICP 100 uses a chemistry of chlorine for both the breakthrough of aluminum oxide and the etching of aluminum underneath.
  • The etch rate has been measure at about 600 nm/min for thin films of Al with a thickness of 100 nm.

Attached Documents

  • application/pdf iconAluminum Cl2 Etch Recipe.pdf
Aluminum Cl2 EtchOxford ICP Etcher