The Alumina etch utilizes a C4F8, CHF3 and Ar chemistry to slowly etch away the resistant
alumina film.
The Oxford ICP 100 etcher is used with this chemistry and the etch rate has been measured
to be about 50 nm/min
This gas chemistry will etch Si, so be sure to stop fairly quickly after the alumina
is completely etched.
Surface roughness seems to vary on etch time. Be sure to measure with the Ambios Profilometer
Attached Documents
Alumina Etch Recipe.pdf
Montana Microfabrication Facility(RRID:SCR_026333) Cobleigh and Barnard Hall Montana State University P.O. Box 173400 Bozeman, MT 59717
Facility Manager: Dr. Andrew Lingley Montana State University 518 Cobleigh Hall Bozeman, MT 59717 Phone: (406) 994-2518 Email: andrew.lingley@montana.edu
Facility Director: Dr. David Dickensheets Montana State University 530 Cobleigh Hall Bozeman, MT 59717 Phone: (406) 994-7874 Email: davidd@montana.edu
Student Offices: 540 Cobleigh Hall Phone: (406) 994-3112
Alumina Etch Recipe.pdf
